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HFA3424
Data Sheet January 1997 File Number
4131.2
2.4GHz - 2.5GHz Low Noise Amplifier
The Intersil 2.4GHz PRISMTM chip set is a highly integrated five-chip solution for RF modems employing Direct Sequence Spread Spectrum (DSSS) signaling. The HFA3424 2.4GHz 2.5GHz low noise amplifier is an optional chip that can be added to the five chips in the PRISMTM chip set. The HFA3424 offers increased sensitivity for systems targeting 802.11 specifications. (See Figure 1, the Typical Application Diagram.)
TM
Features
* Low Noise Figure . . . . . . . . . . . . . . . . . . . . . . . . . . 1.90dB * High Gain . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14dB * Low Power Consumption . . . . . . . . . . . . . . 3V to 5V, 5mA * High Dynamic Range * DC Decoupled RF Input and Output * No External RF Tuning Elements Necessary * Low Cost SOIC 8 Lead Plastic Package
The Intersil HFA3424 PRISMTM is a high performance low noise amplifier in a low cost SOIC 8 lead surface mount plastic package. The HFA3424 employs a fully monolithic design which eliminates the need for external tuning networks. It can be biased using 3V or 5V supplies and has an option for biasing at higher currents for increased dynamic range. The HFA3424 is ideally suited for use where low noise figure, high gain, high dynamic range and low power consumption required. Typical applications include receiver front ends in the Wireless Local Area Network (WLAN) and wireless data collection markets in the 2.4GHz Industrial, Scientific and Medical (ISM) band, as well as standard gain blocks, buffer amps, driver amps and IF amps in both fixed and portable systems.
Applications
* Systems Targeting IEEE 802.11 Standard * TDD Quadrature-Modulated Communication Systems * Wireless Local Area Networks * PCMCIA Wireless Transceivers * ISM Systems * TDMA Packet Protocol Radios * PCS/Wireless PBX * Wireless Local Loop
Ordering Information
PART NUMBER HFA3424IB HFA3424IB96 TEMP. RANGE (oC) -40 to 85 -40 to 85 PACKAGE 8 Ld SOIC Tape and Reel PKG. NO. M8.15
Pinout
HFA3424 (SOIC) TOP VIEW
Functional Block Diagram
VDD RF OUT
GND VBIAS RF IN GND
1 2 3 4
8 7 6 5
GND VDD RF OUT GND EXTENDED BIAS RF IN LNA 1
2-7
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. http://www.intersil.com or 407-727-9207 | Copyright (c) Intersil Corporation 1999 PRISM(R) is a registered trademark of Intersil Corporation. PRISM logo is a trademark of Intersil Corporation.
HFA3424 Typical Application Diagram
HFA3724
(FILE# 4067)
TUNE/SELECT
HSP3824
(FILE# 4064)
RXI DATA TO MAC CTRL SPREAD DPSK MOD. PRISMTM CHIP SET FILE #4063
HFA3424 (NOTE)
(FILE# 4131)
A/D DESPREAD
DPSK DEMOD
HFA3624 UP/DOWN CONVERTER
(FILE# 4066)
I
RXQ
A/D CCA 802.11 MAC-PHY INTERFACE
/2
0o/90o
M U X
M U X
RSSI
A/D TXI
RFPA
HFA3925
(FILE# 4132)
VCO
VCO
TXQ Q
QUAD IF MODULATOR DUAL SYNTHESIZER
DSSS BASEBAND PROCESSOR
HFA3524 (FILE# 4062)
NOTE:
FIGURE 1. TYPICAL TRANSCEIVER AMPLIFIER APPLICATIONS CIRCUIT USING THE HFA3424 Required for systems targeting 802.11 specifications.
For additional information on the PRISMTM chip set, call (407) 724-7800 to access Intersil' AnswerFAX system. When prompted, key in the four-digit document number (File #) of the datasheets you wish to receive.
The four-digit file numbers are shown in Typical Application Diagram, and correspond to the appropriate circuit.
2-8
HFA3424
Absolute Maximum Ratings
Supply Voltage, VDD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +10VDC Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +17dBm Supply Current (Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30mA
Thermal Information
Thermal Resistance (Typical, Note 2) JA (oC/W) SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 165 Maximum Storage Temperature Range . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300oC (SOIC - Lead Tips Only)
Operating Conditions
Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
CAUTION: Stresses above those listed in "Absolute Maximum Ratings" may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES: 1. Only if Pin 2 is used to increase current. 2. JA is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
TA = 25oC, Z0 = 50, VDD = +5V, PIN = -30dBm, f = 2.45GHz, VBIAS = Open Circuit Unless Otherwise Specified PARAMETER MIN 2.4 12 3 2.7 TYP 14 1.90 1.5:1 1.5:1 -14.0 -14.0 3 1 30 5 MAX 2.5 16 2.30 7 5.5 dB dB dBm dBm dB mA V UNITS GHz dB dB
LNA Input Frequency Range Gain Noise Figure Input VSWR Output VSWR Input Return Loss Output Return Loss Output 1dB Compression Input IP3 Reverse Isolation Supply Current at VDD = 5V Supply Range
Typical Performance Curves
18 TA = 25oC 2.0 TA = 25oC 3V, 5mA
NOISE FIGURE (dB)
16 5V, 20mA GAIN (dB) 14 5V, 5mA
1.9 5V, 5mA 1.8
12 3V, 5mA
1.7
5V, 20mA
10 2.2
2.3
2.4 2.5 FREQUENCY (GHz)
2.6
2.7
1.6 2.40
2.42
2.44 2.46 FREQUENCY (GHz)
2.48
2.50
FIGURE 2. GAIN vs FREQUENCY
FIGURE 3. NOISE FIGURE vs FREQUENCY
2-9
HFA3424 Typical Performance Curves
3.0
(Continued)
4
5V, 5mA, TA = 25oC
TA = 25oC 5V, 20mA
2.5 OUTPUT VSWR 2.0 INPUT IP3 (dBm)
2 5V, 5mA 0
1.5 INPUT 1.0 2.2
-2
3V, 5mA
2.3
2.4 2.5 FREQUENCY (GHz)
2.6
2.7
-4 2.40
2.42
2.44 2.46 FREQUENCY (GHz)
2.48
2.50
FIGURE 4. VSWR vs FREQUENCY
FIGURE 5. INPUT IP3 vs FREQUENCY
18 5V, 5mA
2.6 5V, 5mA 85oC NOISE FIGURE (dB)
16 GAIN (dB) -40oC 14 85oC 12 25oC
2.3
2.0
25oC
1.7 -40oC
10 2.2
2.3
2.4 2.5 FREQUENCY (GHz)
2.6
2.7
1.4 2.40
2.42
2.44 2.46 FREQUENCY (GHz)
2.48
2.50
FIGURE 6. GAIN vs FREQUENCY
FIGURE 7. NOISE FIGURE vs FREQUENCY
2-10
HFA3424 Typical Application Circuit
500pF 15nH +VDD RF SIGNAL OUTPUT 2.4GHz (50 TRANSMISSION LINE) SEE NOTE 2 8 7 6 3 5 4
VBIAS (PIN 2) NORMAL BIAS Open EXTENDED BIAS 30 To 35 To Ground
1 PIN 2 ALLOWS FOR AN EXTERNAL RESISTOR RBB TO BE USED TO GROUND FOR AN OPTIONAL 20mA CURRENT OPERATION. RECOMMENDED VALUES FOR THE CHIP RESISTOR ARE 30 TO 35. RF SIGNAL INPUT 2.4GHz (50 TRANSMISSION LINE) SEE NOTE 2
NOTE: 3. No DC blocking capacitor required on LNA input or output transmission lines. FIGURE 8. REFERENCE APPLICATION/TEST DESIGN SETUP SCHEMATIC: LOW NOISE AMPLIFIER
All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (407) 724-7000 FAX: (407) 724-7240 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029
2-11
2
RBB

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